Chin-Li Kao,: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

1

Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes

Kao, Chin-Li, Chen, Tei-Chen

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.20 MB

english, 2018

2

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Wafer Warpage Experiments and Simulation for Fan-Out Chip on Substrate

Lin, Yuan-Ting, Lai, Wei-Hong, Kao, Chin-Li, Lou, Jian-Wen, Yang, Ping-Feng, Wang, Chi-Yu, Hseih, Chueh-An

Year:

2016

Language:

english

File:

PDF, 562 KB

english, 2016

3

Effect of Test Conditions on Electromigration Reliability of Sn–Ag–Cu Flip-Chip Solder Interconnects

Lai, Yi-Shao, Lee, Chiu-Wen, Kao, Chin-Li

Journal:

Journal of Electronic Packaging

Year:

2007

Language:

english

File:

PDF, 1.26 MB

english, 2007

4

Prediction of deformation during manufacturing processes of silicon interposer package with TSVs

Kim, Yeonsung, Park, Ah-Young, Kao, Chin-Li, Su, Michael, Black, Bryan, Park, Seungbae

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.96 MB

english, 2016

5

Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density

Liang, Chien-Lung, Lin, Yung-Sheng, Kao, Chin-Li, Tarng, David, Wang, Shan-Bo, Hung, Yun-Ching, Lin, Gao-Tian, Lin, Kwang-Lung

Journal:

Materials Chemistry and Physics

Year:

2020

File:

PDF, 7.87 MB

2020

6

Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package

Theresa Sze, Darko Popovic, Jing Shi, Yi-Shao Lai, James G. Mitchell, Bruce Guenin, Tsung-Yueh Tsai, Chin-Li Kao, Matthew Giere

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.42 MB

english, 2010

7

Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages

Yi-Shao Lai, Chin-Li Kao

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 847 KB

english, 2006

8

Evaluation of board-level reliability of electronic packages under consecutive drops

Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 280 KB

english, 2006

9

Electromigration Reliability of Advanced High-density Fan-out Packaging with Fine-pitch 2lm/2lm L/S Cu Redistribution Line

Liang, Chien-Lung, Lin, Yung-Sheng, Kao, Chin-Li, Tarng, David, Wang, Shan-Bo, Hung, Yun-Ching, Lin, Gao-Tian, Lin, Kwang-Lung

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 1.61 MB

2020

10

Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy

Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.78 MB

english, 2007

11

Characteristics of current crowding in flip-chip solder bumps

Yi-Shao Lai, Chin-Li Kao

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 520 KB

english, 2006

12

Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages

Kao, Chin-Li, Chen, Tei-Chen, Lai, Yi-Shao, Chiu, Ying-Ta

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 2.86 MB

english, 2014

13

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Fan-Out Chip on Substrate Device Interconnection Reliability Analysis

Lee, Ying-Chih, Lai, Wei-Hong, Hu, Ian, Shih, Meng-Kai, Kao, Chin-Li, Tarng, David, Hung, Ching-Pin

Year:

2017

Language:

english

File:

PDF, 907 KB

english, 2017

14

Characterizations of ball impact responses of wafer-level chip-scale packages

Yi-Shao Lai, Chang-Lin Yeh, Hsiao-Chuan Chang, Chin-Li Kao

Journal:

Journal of Alloys and Compounds

Year:

2008

Language:

english

File:

PDF, 1.64 MB

english, 2008

15

Prognostic Predictors of Outcome in an Operative Series in Traumatic Brain Injury Patients

Jinn-Rung Kuo, Chong-Jeh Lo, Chin-Li Lu, Chung-Ching Chio, Che-Chuan Wang, Kao-Chang Lin

Journal:

Journal of the Formosan Medical Association

Year:

2011

Language:

english

File:

PDF, 371 KB

english, 2011

16

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Electrical, thermal and warpage investigation on high bandwidth PoP

Hung, Mike, Lee, Chang-Chi, Cheng, Hung-Hsiang, Cheng, Morris, Lin, Timmy, Lee, Ying-Chih, Kao, Chin-Li, Pan, Po-Chih

Year:

2013

Language:

english

File:

PDF, 462 KB

english, 2013

17

Calibration of electromigration reliability of flip-chip packages by electrothermal coupling analysis

Yi-Shao Lai, Chin-Li Kao

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 307 KB

english, 2006

18

[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Ball impact responses and failure analysis of wafer-level chip-scale packages

Lai, Yi-Shao, Yeh, ChangLlin, Chang, Hsiao-Chuan, Kao, Chin-Li

Year:

2006

Language:

english

File:

PDF, 898 KB

english, 2006

19

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Manufacturability and reliability of a high-speed CSP SRAM on an interposer package

Kuo-Chuan Liu,, Priest, Judy, Jie Xue,, Jarsh Lin,, Chin-Li Kao,, Tong Hong Wang,, Yi-Shao Lai,

Year:

2008

Language:

english

File:

PDF, 917 KB

english, 2008

20

In

Albert T. Wu, Chun-Yang Tsai, Chin-Li Kao, Meng-Kai Shih, Yi-Shao Lai, Hsin-Yi Lee, Ching-Shun Ku

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 326 KB

english, 2009

21

[IEEE Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Electrothermal coupling analysis of current crowding and Joule heating in flip-chip package assembly

Chin-Li Kao,, Yi-Shao Lai,

Year:

2004

Language:

english

File:

PDF, 397 KB

english, 2004

22

Performance Characterization of Dye-Sensitized Photovoltaics under Indoor Lighting

Chen, Chia-Yuan, Jian, Zih-Hong, Huang, Shih-Han, Lee, Kun-Mu, Kao, Ming-Hsuan, Shen, Chang-Hong, Shieh, Jia-Min, Wang, Chin-Li, Chang, Chiung-Wen, Lin, Bo-Zhi, Lin, Ching-Yao, Chang, Ting-Kuang, Chi,

Journal:

The Journal of Physical Chemistry Letters

Year:

2017

Language:

english

File:

PDF, 2.40 MB

english, 2017

23

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Reliability improvements for advanced Wafer Level packaging

Hunt, John, Huang, Danial, Chiu, Jessica, Liu, MaggieMC, Lin, Junior, Lou, JW, Chen, Chienfan, Kao, Chin-Li

Year:

2010

Language:

english

File:

PDF, 2.81 MB

english, 2010

24

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer

Lee, Chang-Chi, Hung, Cp, Cheung, Calvin, Yang, Ping-Feng, Kao, Chin-Li, Chen, Dao-Long, Shih, Meng-Kai, Chien, Chien-Lin Chang, Hsiao, Yu-Hsiang, Chen, Li-Chieh, Su, Michael, Alfano, Michael, Siegel,

Year:

2016

Language:

english

File:

PDF, 788 KB

english, 2016

25

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Electromigration reliability of redistribution lines in wafer-level chip-scale packages

Lai, Yi-Shao, Kao, Chin-Li, Chiu, Ying-Ta, Appelt, Bernd K.

Year:

2011

Language:

english

File:

PDF, 1.35 MB

english, 2011

26

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Integrating electrothermal coupling analysis in the calibration of experimental electromigration reliability of flip-chip packages

Yi-Shao Lai,, Sathe, S., Chin-Li Kao,, Chiu-Wen Lee,

Year:

2005

Language:

english

File:

PDF, 699 KB

english, 2005

27

[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - Effect of Multiple Reflow Cycles on Ball Impact Responses of Sn-4Ag-0.5Cu Solder Joints with Immersion Tin Substrate Pad Finish

Lai, Yi-Shao, Kao, C. R., Chang, Hsiao-Chuan, Lee, Shu-Hua, Kao, Chin-Li, Lan, Wen-How

Year:

2008

Language:

english

File:

PDF, 4.30 MB

english, 2008

28

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - The IMC formation and progress in the copper pillar Cu/Sn1.8Ag /OSP-Cu microbump structure upon current stressing

Chen, Chiao-Wen, Lin, Kwang-Lung, Chiu, Ying-Ta, Kao, Chin-Li, Lee, Chiu-Wen, Yang, Ping-Feng

Year:

2014

Language:

english

File:

PDF, 370 KB

english, 2014

29

[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Warpage characterization analysis for Embedded package technology

Chen, Tang-Yuan, Shih, Meng-Kai, Chen, Ming-Hung, Chen, Wei-Chung, Uegaki, Shoji, Kao, Chin-Li, Yang, Ping-Feng, Hung, Chin-Pin

Year:

2016

Language:

english

File:

PDF, 421 KB

english, 2016

30

A Novel Speckle-Free Digital Image Correlation Method for In Situ Warpage Characterization

Niu, Yuling, Shao, Shuai, Park, S. B., Kao, Chin-Li

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2017

Language:

english

File:

PDF, 2.29 MB

english, 2017

31

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Development of a consistent multiaxial viscoelastic model for package warpage simulation

Chiu, Tz-Cheng, Huang, Dong-Yi, Lee, Bo-Sheng, Chen, Dao-Long, Yang, Ping-Feng, Kao, Chin-Li

Year:

2015

Language:

english

File:

PDF, 769 KB

english, 2015

32

Measurement of tau in human CSF and its possible utility in Alzheimer's disease diagnosis

Kao, Chin-Li, Chen, Tei-Chen, Lai, Yi-Shao, Chiu, Ying-Ta

Journal:

Neurobiology of Aging

Year:

1994

Language:

english

File:

PDF, 167 KB

english, 1994

33

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - A comparison study of electromigration performance of Pb-free flip chip solder bumps

Peng Su,, Li Li,, Yi-Shao Lai,, Ying-Ta Chiu,, Chin-Li Kao,

Year:

2009

Language:

english

File:

PDF, 1.22 MB

english, 2009

34

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - TSV technology for 2.5D IC solution

Wang, Meng-Jen, Hung, Chang-Ying, Kao, Chin-Li, Lee, Pao-Nan, Chen, Chi-Han, Hung, Chih-Pin, Tong, Ho-Ming

Year:

2012

Language:

english

File:

PDF, 1004 KB

english, 2012

35

Electrothermal coupling analysis and experimental verification for wirebond devices

Kao, Chin-Li, Chen, Tei-Chen

Journal:

Transactions of the Canadian Society for Mechanical Engineering

Year:

2018

File:

PDF, 4.27 MB

2018

36

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Electromigration Failure Study of a Fine-pitch 2Î¼m/2Î¼m L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging

Liang, Chien-Lung, Lin, Yung-Sheng, Kao, Chin-Li, Tarng, David, Wang, Shan-Bo, Hung, Yun-Ching, Lin, Kwang-Lung

Year:

2020

File:

PDF, 2.37 MB

2020

37

Erratum to:In SituMeasurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays

Albert T. Wu, Chun-Yang Tsai, Chin-Li Kao, Meng-Kai Shih, Yi-Shao Lai, Hsin-Yi Lee, Ching-Shun Ku

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 78 KB

english, 2009

38

Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis

Yi-Shao Lai, Chin-Li Kao

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 101 KB

english, 2008

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@1delivery.pm

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски